JPS63149542U - - Google Patents
Info
- Publication number
- JPS63149542U JPS63149542U JP4245587U JP4245587U JPS63149542U JP S63149542 U JPS63149542 U JP S63149542U JP 4245587 U JP4245587 U JP 4245587U JP 4245587 U JP4245587 U JP 4245587U JP S63149542 U JPS63149542 U JP S63149542U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- circuit board
- printed circuit
- mounting means
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4245587U JPS63149542U (en]) | 1987-03-23 | 1987-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4245587U JPS63149542U (en]) | 1987-03-23 | 1987-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63149542U true JPS63149542U (en]) | 1988-10-03 |
Family
ID=30858379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4245587U Pending JPS63149542U (en]) | 1987-03-23 | 1987-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63149542U (en]) |
-
1987
- 1987-03-23 JP JP4245587U patent/JPS63149542U/ja active Pending
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